Spansion and Atheros
Communications Team to Deliver Innovative Packaging Solution for Handset
Manufacturers
Leading Flash Memory and
Wireless LAN Providers Develop Package-on-Package to Enable Small
Dual-Mode Mobile Phones
SANTA CLARA, Calif., Sept.
19, 2005— Spansion LLC, the Flash memory venture of AMD
(NYSE:AMD) and Fujitsu Limited (TSE:6702), and Atheros Communications,
Inc. (NASDAQ: ATHR), a leading developer of advanced wireless solutions,
today announced they have developed an innovative packaging solution
that is designed to significantly reduce the size of today’s dual-mode
Cellular/Wireless LAN (WLAN) mobile phones. The packaging solution
vertically stacks the Atheros Radio-on-Chip for Mobile (ROCm®) 802.11a/g
and 802.11g solutions with Spansion™ MirrorBit™ Flash memory. This
solution enables handset manufacturers to provide valuable new services,
such as Voice-over-IP (VoIP) and WLAN data connectivity for fast
download of content such as ring tones, music, video clips, games, and
email, in very small form factors.
An innovative approach to semiconductor packaging,
Package-on-Package (PoP) solutions vertically stack system components
for board savings, lower pin-count, simplified system integration and
enhanced performance. The resulting PoP enables handset suppliers
increased flexibility as compared to alternative packaging solutions
like System-in-Package (SIP). The new PoP solutions
based on the Atheros and Spansion devices will combine WLAN radio and
baseband functions with the high-density code and data storage required
by the vast majority of handset end-products--in a small footprint
measuring only 160 mm2. In comparison, a similarly configured
solution using discrete chips can be as large as 800 mm2.
“Connectivity and content will drive adoption of
next-generation cell phones,” said Amir Mashkoori, senior vice president
and general manager of Spansion’s Wireless Solutions Division. “As
handset manufacturers require more memory to enable new features and
Wi-Fi to deliver the bandwidth necessary for consumers to access and
download rich content and applications on their phones, Atheros and
Spansion have each contributed to the ideal solution. Together, we
expect both companies will play a key role in enabling cellular, Wi-Fi
convergence.”
Spansion offers a 12 x 12 mm package that
integrates up to five different memory chips in a 128-ball solution with
a 0.65 mm pitch. This package rests on top of an Atheros package, also
measuring 12 x 12 mm, which provides the ROCm 802.11a/g and 802.11g
(AR6001 family) Mobile WLAN chips in a 376-ball package with a 0.5 mm
pitch.
“Our drive towards low power, low cost and small
footprints is enabling high-performance WLAN technology in more handheld
devices such as dual-mode phones,” said Craig Barratt, president and
chief executive officer of Atheros. “We are pleased to be working with
Spansion, leveraging their technical expertise in developing advanced
packaging solutions and success in mobile phone and handheld markets.
Together we’ll offer an innovative solution for integrating WLAN
capabilities into new, smaller mobile phones with better performance and
cost savings.”
Atheros ROCm® Platform
The Atheros ROCm solutions minimize power
consumption through the use of techniques such as automatic power save
delivery (APSD) and an extremely low-power sleep mode. ROCm also
processes beacons, multi-cast and broadcast packets without waking up
the host system processor, thus further reducing the power consumption
and improving the battery life.
Availability
The memory and logic packages are expected to be
available in the fourth quarter from Spansion and Atheros, respectively,
for assembly into a total PoP solution. For more details about the
solution, please contact
info@atheros.com or
www.spansion.com.
About Spansion
Spansion, the Flash memory venture of AMD and
Fujitsu, is the largest company in the world dedicated exclusively to
developing, designing, and manufacturing Flash memory products. In
fiscal 2004, Spansion's total net sales were approximately $2.3 billion.
The company offers the broadest NOR Flash memory portfolio in the
industry, for use in the wireless, automotive, networking,
telecommunications and consumer electronics markets. The company's
portfolio is supported by a worldwide network of advanced manufacturing
facilities, system-level expertise and dedicated design support, and an
unwavering commitment to our customers’ success. Information about
Spansion Flash memory solutions is available at
www.spansion.com.
About Atheros
Communications, Inc.
Atheros Communications is a leading developer of
semiconductor system solutions for wireless communications products.
Atheros combines its wireless systems expertise with high-performance
radio frequency (RF), mixed signal and digital semiconductor design
skills to provide highly integrated chipsets that are manufacturable on
low-cost, standard complementary metal-oxide semiconductor (CMOS)
processes. Atheros technology is being used by a broad base of leading
customers, including personal computer, networking equipment and handset
manufacturers. For more information visit,
www.atheros.com or send email to
info@atheros.com.
# # #
Spansion, the Spansion logo,
MirrorBit, and combinations thereof, are trademarks of Spansion LLC. AMD
is a trademark of Advanced Micro Devices, Inc. Atheros is a registered
trademark of Atheros Communications, Inc., and ROCm is a trademark of
Atheros Communications, Inc. Other names used are for informational
purposes only and may be trademarks of their respective owners.
Cautionary Statement
Except for the historical
information contained herein, the matters set forth in this press
release, including the features, performance, benefits, and availability
of the PoP packaging solution of Spansion and Atheros, Atheros’ ROCm
solutions, and Spansion’s MirrorBit Flash memory; and the anticipated
adoption of dual-mode WLAN/cellular mobile phones and other handsets
that integrate WLAN technology, and the growth of these markets, are
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995. These forward-looking statements are
subject to risks and uncertainties that could cause actual results to
differ materially, including, but not limited to, the impact of
competitive products and technological advances; unforeseen defects in
the integration of Atheros’ and Spansion’s products into the PoP
packaging solution that may be discovered upon volume production and
broad deployment; manufacturing difficulties; difficulties in
development of enhanced and new products; whether Atheros and Spansion
are successful in marketing and selling the PoP solution; whether
Atheros and Spansion are able successfully to negotiate and coordinate
timing of production and volumes of products to create the PoP solution;
Atheros’ lack of experience in cellular phone markets; whether the
markets for WLAN-enabled mobile devices grow; general economic
conditions; and the effects of regulation of cellular and other wireless
markets. We urge investors to review in detail the risks and
uncertainties in Atheros’ Annual Reports on Form 10-K and Quarterly
Reports on Form 10-Q, Spansion’s Registration Statement on Form S-1 and
AMD’s Quarterly Report on Form 10-Q for the quarter ended June 26, 2005,
and in other reports filed with the SEC from time to time. These
forward-looking statements speak only as of the date hereof. The
companies disclaim any obligation to update this cautionary statement.
